Effects of different processing parameters on laser water jet machining of silicon
Y.L. Chen1, X. Li1, X.H. Chen2, H. Li1
1Hefei University of Technology, Hefei, Anhui ,China
2Anhui Jianzhu University, Hefei, Anhui,China
Keywords: laser water jet processing, silicon, processing parameters, groove, depth
Abstract
Laser water jet processing is a new hybrid method developed on the basis of traditional laser processing technology. It combines high laser processing efficiency with the impact and cooling effects of water jets. Laser water jet processing can effectively process hard and brittle materials such as silicon. In-depth study of the processing technology has important practical significance. For this reason, the controlled variable method is used to study the influence of different processing parameters on groove depth. The research results show that with the increase of current and laser pulse width , the groove depth gradually increases; with the increase of laser repetition frequency and water jet velocity, the groove depth increases first and then decreases. The experiment of laser water jet processing silicon can provide guidance for processing other difficult-to-process materials in the future.
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