Enhancement of transient heat transfer at boiling on a plate surface with low thermoconductive coatings
A.N. Tsoi and A.N. Pavlenko
Kutateladze Institute of Thermophysics SB RAS, Novosibirsk, Russia
E-mail: tsoialexei@ngs.ru
Keywords: film boiling, nucleate boiling, transient heat transfer, liquid nitrogen, low thermoconducting coating, heat transfer coefficient, cooling rate
Pages: 707–712
Abstract
An experimental study of transient cooling in liquid nitrogen of strongly overheated copper plate coated with a low thermoconductive coating with thickness δ from 0.09 to 0.67 mm was performed. It is shown that the low thermoconductive coating has a significant effect on the character of temperature curves and total time of plate cooling. It was revealed that the most significant decrease in the time of plate cooling by the factor of 2.6 is achieved for the thickness of the low thermoconducting layer of 0.09 mm as compared to the case without coating.
DOI: 10.1134/S0869864315060062
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