Investigation of Powders to Make Lead-Free Paste for High-Temperature Soldering of Copper Alloys
V. V. KAICHEV1 and V. E. DIAKOV2
1Boreskov Institute of Catalysis, Siberian Branch of the Russian Academy of Sciences,
Pr. Akademika Lavrentyeva 5, Novosibirsk 630090 (Russia)
E-mail: vvk@catalysis.ru
2JSC
Pages: 141-146
Abstract
Investigation of a series of fine powders of the copper alloy with the addition of 15 mass % tin,
4 mass % nickel and 5 mass % phosphorus was carried out by means of X-ray photoelectron spectroscopy. It was shown that the chemical composition of subsurface layers of powder particles of the solder depends on preparation procedure and affects the quality of soldering.
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