REAL-TIME CONTROL OF SURFACE SHAPES OF COMPONENTS OF INFRARED-RANGE FLIP-CHIP PHOTODETECTORS
A. R. Novoselov1, P. A. Aldokhin1, A. E. Matochkin2, P. P. Dobrovolskii1, K. P. Shatunov1
1Design and Technology Institute of Applied Microelectronics, 630090, Novosibirsk, prosp. Akademika Lavrent'eva, 2/1
2Institute of Automation and Electrometry, Siberian Branch, Russian Academy of Sciences, 630090, Novosibirsk, prosp. Akademika Koptyuga, 1
Keywords: фотоприёмное устройство, автоколлимационный метод, интерференционный метод, photodetector, autocollimation method, interference method
Abstract
A possibility of using the autocollimation and interference methods for real-time nonintrusive control of the surface shapes of photodetectors that are sensitive in the infrared range and are fabricated by the flip-chip technology is considered. These methods allow monitoring the surface shapes and the maximum deflections. These methods are applied in the present study to measure the surface shapes of fragments of silicone instrumental boards and arrays of photosensitive elements on GaAs substrates, as well as the surface shapes of photodetectors at different stages of fracture and in the course of thermal cycling.
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