On-Line Testing of Flip-Chip Assemblies
A. R. Novoselov, I. G. Kosulina
Keywords: photodetectors, flip-chip technology, bonding indium bumps, adhesion, fracture strength
Pages: 119-122
Abstract
This paper considers a destructive method of testing the strength flip-chip assemblies (in particular, photodetectors) which consists of separating one microcircuit from another with heating (not below 383 K) after thermal cycling. The method can be used to test the adhesive properties of bonding bumps, for example indium ones, in flip-chip assemblies and determine the causes of debonding in photodetectors. Examples of the causes of failures of cooled photodetectors based on HgCdTe molecular beam epitaxy are discussed.
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